mta’s MLH45 laser head is primarily used for soldering robots on joints that are too small for the iron – smaller than 1mm. For the smallest applications, we combine the laser heat source with optical realignment and micro-dispensing jetting. This guarantees mastery of the total process especially in cases where solder wire size is too large to achieve optimal results.
Furthermore, we also use the MLH45 laser head for soldering robots when the part requires a non-contact heat source. Or in case the joints are in tight places that physical heating units cannot reach.
We can offer turnkey solutions by integrating the laser MLH45 on two of our standard soldering platforms: laser MRC500 robotic cell and TR300 table-top robot.
N.B. We add metal sides and a mechanical door to the TR300 table-top robot to protect operators from the laser.
The main features of our laser head include:
- The ability to solder very small joints
- Easy teaching with integrated monitoring and laser pointer
- Diode laser with optical fiber
- Non-contact soldering
- Jam-free wire feeder mounted directly on the head provides tight process control
- Compatible with RoHS (lead-free) solder
5 reasons to choose the mta MLH45 laser soldering head
- We can combine the laser with solder paste jetting system to solder very small joints.
- Optional fiducial recognition is able to realign the paste jetting system and laser.
- The laser fires straight down, so it is able to reach joints inaccessible by iron, induction and microflame.
- We mounted our precise jam-free solder wire feeder directly on the head – at the solder joint. This provides tight process control of the wire feed. Additionally, solder wire does not kink or get jammed since there is no long feed tube. Once the correct amount is fed, the wire feeder pulls the wire out of the solder pool to prevent solder spatter.
- Optionally, the solder paste jetting, is offset on the same head, so one robot provides both functions – no need for a second robot to apply solder paste to the parts.
