Solder paste dispensers

Solder paste dispensers for laser and induction

The soldering market is heading towards smaller and smaller applications. Therefore, the size of the solder wire and the influence of its contact with the components become a limit for the achievable process accuracy.

In order to ensure the excellence of its laser and induction processes with the smallest parts, mta robotics now has the capability to integrate solder paste micro-dispensing jet valve or traditional solder paste dispenser. This is integrated directly next to the soldering head, and within the same equipment.

The proximity between the solder paste dispenser and the soldering process ensures a perfect mastering of the complete process. Moreover, due to the complete integration of both process steps within the same automated equipment, the investment costs can be optimized.

3 reasons to choose the solder paste jet valve

  1. No accessibility problems due to non-contact solder paste dispensing process.
  2. Dedicated to very small dispensed solder paste quantity.
  3. No solder wire positioning or adjustment.

2 reasons to choose the traditional solder paste dispenser

  1. Used for medium up to large quantities of solder paste.
  2. Optimized cycle time and more effective process through combined solder paste dispensing and soldering operation.

Shipping costs incl.

Solder paste micro-dispensing jet valve

  • Mainly dedicated for PCBs
  • High precision dispensing of very small volume of solder paste
  • Typical process: jet dispensing, i.e. jetting of solder paste combined with laser micro-soldering

Traditional solder paste dispenser

  • Mainly dedicated for PCBs and connectors
  • High precision dispensing of large volume of solder paste
  • Typical process: solder paste dispensing comined with induction or laser soldering

The standard solder paste jet valve and traditional solder paste dispenser come well-equipped:

  • Dispenser head structure
  • Needle or nozzle according to application
  • Purge bin
  • Controller

Only for the traditional dispenser

  • Needle recentering camera
  • Cleaning unit
  • Automated sponge humidification system

 

Options within mta platforms:

  • Monitoring camera
  • Vision for recentering
  • Vision for quality inspection
  • Part presence sensor
  • Part height measuring sensor
  • Container with or without mixer
  • Level detection – tank or cartridge
  • Material preparation and supply systems such as desassing, pre-heating, homogenization

Solder paste jet valve

  • Type of drive  electropneumatic
  • Type of operation  normally closed (NC)
  • Operating voltage  24 VDC
  • Pulse length  from 1.9 ms
  • Dispensing frequency  up to 300 Hz continuous
  • Working pressure  4-8 bar (55-115 PSI)
  • Dispensing volume  from 1 nL /droplet-Ø: from 0.25 mm)
  • Viscosity  0.5  – 500,000 mPas
  • Dispensing accuracy  > 98%
  • Lifetime  > 100 Mio. cycles
  • Material pressure  maximum 100 bar (1450 PSI)
  • Material connection  G1/8 internal thread
  • Heater temperature  up to 100°C (212 Fahrenheit)
  • Dimensions (W x L x H)  20 x 53 x 126 mm (0.79 x 2.09 x 4.96 inch)
  • Weight  330 g (0.728 lb)

 

Traditional solder paste dispenser 

  • Dispensing amount  up to Ø 0.75 mm
  • Maximum operating frequency  more than 300 cycles/minute / 5Hz
  • Container  cartridges (10 cm³ and 30 cm³) or tanks
  • Air pressure  2.1 bar (30 psi)
  • Dispenser dimensions  38 x 94 x 196 mm
  • Dispenser weight  ~390 g
  • Controller power and frequency  100-240 VAC, 50/60 Hz
  • Controller power consumption  15W

Video

Application examples

Solder paste micro-dispensing jet valve

  • Mainly dedicated for PCBs
  • High precision dispensing of very small volume of solder paste
  • Typical process: jet dispensing, i.e. jetting of solder paste combined with laser micro-soldering

Traditional solder paste dispenser

  • Mainly dedicated for PCBs and connectors
  • High precision dispensing of large volume of solder paste
  • Typical process: solder paste dispensing comined with induction or laser soldering

Included equipment

The standard solder paste jet valve and traditional solder paste dispenser come well-equipped:

  • Dispenser head structure
  • Needle or nozzle according to application
  • Purge bin
  • Controller

Only for the traditional dispenser

  • Needle recentering camera
  • Cleaning unit
  • Automated sponge humidification system

 

Options within mta platforms:

  • Monitoring camera
  • Vision for recentering
  • Vision for quality inspection
  • Part presence sensor
  • Part height measuring sensor
  • Container with or without mixer
  • Level detection – tank or cartridge
  • Material preparation and supply systems such as desassing, pre-heating, homogenization

Specifications

Solder paste jet valve

  • Type of drive  electropneumatic
  • Type of operation  normally closed (NC)
  • Operating voltage  24 VDC
  • Pulse length  from 1.9 ms
  • Dispensing frequency  up to 300 Hz continuous
  • Working pressure  4-8 bar (55-115 PSI)
  • Dispensing volume  from 1 nL /droplet-Ø: from 0.25 mm)
  • Viscosity  0.5  – 500,000 mPas
  • Dispensing accuracy  > 98%
  • Lifetime  > 100 Mio. cycles
  • Material pressure  maximum 100 bar (1450 PSI)
  • Material connection  G1/8 internal thread
  • Heater temperature  up to 100°C (212 Fahrenheit)
  • Dimensions (W x L x H)  20 x 53 x 126 mm (0.79 x 2.09 x 4.96 inch)
  • Weight  330 g (0.728 lb)

 

Traditional solder paste dispenser 

  • Dispensing amount  up to Ø 0.75 mm
  • Maximum operating frequency  more than 300 cycles/minute / 5Hz
  • Container  cartridges (10 cm³ and 30 cm³) or tanks
  • Air pressure  2.1 bar (30 psi)
  • Dispenser dimensions  38 x 94 x 196 mm
  • Dispenser weight  ~390 g
  • Controller power and frequency  100-240 VAC, 50/60 Hz
  • Controller power consumption  15W

Contact us


You may also like…